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Power, Optimize, Secure
EPYC™ meets the needs for today’s datacenter workloads
Flexibility. Performance. Security. Born in the cloud, the AMD EPYC system on chip delivers 122 percent better memory bandwidth, 60 percent more I/O and 45 percent more cores than the competitor to power data center applications. Whether you deploy bare metal, virtualized, or in the cloud, the AMD EPYC processor powers fast, responsive, and secure IT.
THE CLOUD HAS CHANGED EVERYTHING
Rapid cloud computing adoption has precipitated a paradigm shift in the industry. Resources are now software defined, and security is more important than ever. Beyond the cloud, advances in software have created entirely new workload classes. These include mobile applications, digital business transformation, big data, predictive analysis, and machine learning where data is analyzed and conclusions are made in real time, all without human intervention
While the pace of software innovation has quickened, it has been lacking support from the foundational infrastructure in silicon. More than just incremental improvements in processor speed are needed to efficiently support today’s software-defined datacenter. With automatic Moore’s Law performance increases slowing, innovation is now more important than ever. An approach that better balances the ratios of cores, memory, I/O bandwidth, and that deploys security features embedded in silicon is essential to achieve optimized performance for today’s datacenter applications
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Focus on your business. With a server built for your business.
BOLData® can help you enhance your business with a reliable computing environment that helps employees easily share and update information from a central, secure location. We build servers that are designed for businesses like yours, with products and software from trusted brands like AMD®, Intel® and Microsoft®.Choose from various Microsoft Server solutions, or load up Linux!
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DDR4—Packing Power and Performance into a New Generation
To compete in growing enterprise and cloud computing markets, you need significant power savings and performance advancements. DDR4 has a rich set of features that address reliability, speed, power, and stacking capabilities— taking application performance to an entirely new level beyond DDR3.DDR4 is ideal for high-end enterprise and storage systems as well as cloud server providers that support applications requiring large memory footprints, such as in-memory databases and real-time analytics.
DDR4 is the newest iteration in DRAM, loaded with new features that improve reliability, speed, power, and stacking capabilities for the enterprise, micro-server, ultrathin, and tablet markets. With data rates reaching 2666 Mb/s, DDR4 increases performance up to 50% over DDR3. DDR4 also delivers a 20% reduction in voltage over DDR3—however, when DDR4’s additional power-saving features are taken into account, total overall power savings versus DDR3 can be as much as 35%.
The new boundary scan feature (also known as JTAG) enables early fault detection during testing, thereby reducing debug time, improving system reliability, and ultimately, saving development and production costs.
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Terabytes and Terabytes…
The biggest data management concerns for large enterprises today are planning for growth and protecting data from misuse, loss and inaccessibility. BOLData® storage solutions help address these issues. Choose from large capacity SATA-3/6G and high performance SAS-3/12G storage solutions and lightning fast SSD and NVMe technologies. BOLData® servers utilize the latest enterprise hard drives to offer the best combination of capacity, performance, reliability and value for all your enterprise storage application needs.
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Operating System
Microsoft® Windows® Server 2019 Standard
Red Hat Enterprise Linux
Ubunto
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Processor, Chipset & Memory
Single AMD EPYC™ 7000-series Processor
Socket SP3
Up to 32 Cores
System on Chip (SoC)
Sixteen DIMM sockets
Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM
8-channel memory bus
DDR4 2666 MHz Registered ECC, 240-pin gold-plated DIMMs
(*available memory is operating system dependent)
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Storage
Hard Drive Options
16x SATA 3.0 ports (6Gbps)
U.2
Up to 6 U.2 NVMe support via additional cables
M.2
Interface: PCI-E 3.0 x4 (NVMe based)
Form Factor: 2280, 22110
Key: Onboard M-key
Number of M.2: Dual
Options:
16 hot-swap 2.5" SATA3 drive bays, or
10 hot-swap 2.5" SATA3 drive bays +
optional 6 U.2 NVMe drive support with
additional cables
Optical Drive Options
DVD-ROM/DVD-RW/Blu-Ray Drive (optional)
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Connectivity
2x 10GBase-T LAN ports via Broadcom BCM57416
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Chassis
2U Rackmount Chassis
Externally available: 16 x 2.5 inch hot-swap, 1 x 5.25 inch
(H x W x D): 89 x 437 x 630 mm / 3.5 x 17.2 x 24.8 inches
SAS/SATA Hot-Swap Trays: eight (16)
1200W Redundant Power Supplies Titanium Level (96%)
(Full redundancy based on configuration and application load)
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PC Health Monitoring
CPU
Monitors CPU Core Voltages, +1.8V, +3.3V, +5V, +5V standby, 3.3V standby, VBAT
CPU switching voltage regulator
FAN
Up to 6-fan status tachometer monitoring
Up to six 4-pin fan headers
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Temperature
Monitoring for CPU and chassis environment
CPU Thermal Trip Support
Thermal control for 6x Fan connectors
I²C Temperature Sensing Logic
LED
CPU / System Overheat LED
Other Features
Chassis Intrusion Detection
Chassis Intrusion Header
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Management
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
ASPEED AST2500 BMC
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Connections
PCI-Express
1 x PCI-E 3.0 x16 (FH/HL) slot,
2 x PCI-E 3.0 x8 (FH/HL) slots,
2 x PCI-E 3.0 x8 (LP) slots
M.2 Interface: PCI-E 3.0 x4 (NVMe based)
M.2 Form Factor: 2280, 22110
M.2 Key: Onboard M-key
Number of M.2: Dual
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